A SEMICONDUCTOR MODULE AND A METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor module and a method of manufacturing the same are provided to prevent bending of the semiconductor package by contact of the upper face of the semiconductor package. CONSTITUTION: The semiconductor package(120) is mounted in one face or both sides of the module PCB(110). The plate(130) for preventing warpage covers up the semiconductor package on the module PCB. The plate for preventing warpage is contacted with the upper side of the semiconductor package to prevent the bending in the reflow process of the semiconductor package.