发明名称 |
HEAT TREATMENT APPARATUS AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
PURPOSE: A heat treatment apparatus and a substrate processing apparatus are provided to cool down a substrate after a heat treatment process by moving a return arm from a hot plate to a cool plate while the rear side of the return arm is contacted with the surface of the cool plate. CONSTITUTION: A hot plate(60) heats a substrate. A cool plate(70) cools down the substrate. A transfer apparatus(80) returns a substrate between the hot plate and the cool plate. A return arm has a plane bigger than the plane size of the substrate and transfer the substrate. The arm drive machinery(81) transfers the return arm between the hot plate and the cool plate. The rear side of the return arm is contacted with the surface of the cool plate and the substrate is cooled down through the return arm.
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申请公布号 |
KR20100012813(A) |
申请公布日期 |
2010.02.08 |
申请号 |
KR20090061113 |
申请日期 |
2009.07.06 |
申请人 |
SOKUDO CO., LTD. |
发明人 |
SHIBA YASUHIRO;TSUJI MASAO;MASUDA MITSUHIRO;GOTO SHIGEHIRO |
分类号 |
H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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