MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a printed circuit board is provided to flip-bond an IC on a substrate by forming a solder bump on a central part of a pad. CONSTITUTION: A circuit pattern(20) is formed on an insulation layer(10). A solder resist is stacked on an insulation layer to cover a circuit pattern. The solder resist corresponding to the pad is selectively removed. A tin layer is plated on the central part not to contact with the solder resist. The surface of the tin layer is flat. A solder bump(60) covers the pad and the tin layer. The central part of the solder bump is protruded.