| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging apparatus improving packaging precision and operation stability of electronic components, and downsizing the component and reducing its cost easily, and also to provide a nozzle height adjustment method using the electronic component packaging apparatus. <P>SOLUTION: The electronic component packaging apparatus includes: an elevation/lowering shaft 3 having a suction nozzle 2 for sucking electronic components at the tip side; and axial movement mechanisms 5, 7 for moving the elevation/lowering shaft axially so that the suction nozzle advances or retreats between a packaging position for packaging the sucked electronic components on a substrate and a retraction position. The electronic component packaging apparatus also includes: a shaft-like connection member for connecting the axial movement mechanism to the elevation/lowering shaft; and a joint for rotatably connecting the connection member to the elevation/lowering shaft. The electronic component packaging apparatus also includes: a rotating mechanism for rotating the elevation/lowering shaft around an axis; and a suction nozzle movement mechanism for moving the elevation/lowering shaft in two axial directions nearly vertical to the axial direction. A position adjustment means for adjusting the position of the suction nozzle 2 is provided in the joint. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
