| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling device and a sheet peeling method which can smoothly peel off an adhesive sheet from an adherend while suppressing the generation of rise or cracks in the adherend such as a wafer. SOLUTION: By peeling off an end part of an adhesive sheet S from a wafer W in a primary peeling step, sticking a second adhesive region of a peeling tape T to the adhesive sheet S by a second depression head 34 in a secondary sticking step and peeling off the whole adhesive sheet S from the wafer W in a secondary peeling step, the adhesive sheet S can be gradually peeled off. By depressing the adhesive sheet S and the peeling tape T arranged on the upper surface of a pad 60 in the secondary sticking step, the pad 60 can be supported by depression force from a depression head 33 and the adhesion area of the second adhesive region can be largely set. Thereby, generation of cracks caused by the rise of the wafer W can be prevented and the adhesive sheet S can be smoothly peeled off from the wafer W. COPYRIGHT: (C)2010,JPO&INPIT |
