| 摘要 |
PROBLEM TO BE SOLVED: To provide a ring frame that eliminates a possibility of bending of a resin-made frame. SOLUTION: The ring frame includes a hollow ring type resin frame 10 which stores a semiconductor wafer 1 and an adhesive tape 12 stuck removably on a flat reverse surface of the resin frame 10 to adhesively hold the stored semiconductor wafer 1, wherein ring-shaped support ribs 13 which secure rigidity are formed projecting on a flat surface of the resin frame 10 and have their upper surfaces flattened, the support ribs 13 being positioned between nearby an inner peripheral edge or the inner peripheral edge itself, and an outer peripheral edge of the resin frame 10. Thus, the support ribs 13 enhancing the strength are formed on the surface of the resin frame 10 in one body, so even when the frame is molded out of a molding material containing a predetermined resin, there is no deficiency in rigidity and the possibility of arcuate bending of the resin frame 10 is effectively eliminated. COPYRIGHT: (C)2010,JPO&INPIT |
