发明名称 DICING DIE-BONDING FILM
摘要 A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2-CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2-CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxyl group.
申请公布号 US2010029060(A1) 申请公布日期 2010.02.04
申请号 US20090533272 申请日期 2009.07.31
申请人 发明人 KAMIYA KATSUHIKO;MATSUMURA TAKESHI;MURATA SHUUHEI;OOTAKE HIRONAO
分类号 H01L21/31;B32B27/38;B32B37/06 主分类号 H01L21/31
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