| 摘要 |
Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.
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