发明名称 Method and Apparatus for Forming a High Quality Low Temperature Silicon Nitride Layer
摘要 A method of forming a silicon nitride layer is described. According to the present invention, a silicon nitride layer is deposited by thermally decomposing a silicon/nitrogen containing source gas or a silicon containing source gas and a nitrogen containing source gas at low deposition temperatures to form a silicon nitride layer. The thermally deposited silicon nitride layer is then treated with hydrogen radicals to form a treated silicon nitride layer.
申请公布号 US2010029094(A1) 申请公布日期 2010.02.04
申请号 US20090577922 申请日期 2009.10.13
申请人 APPLIED MATERIALS, INC. 发明人 WANG SHULIN;SANCHEZ ERROL ANTONIO;CHEN AIHUA
分类号 H01L21/31;C23C16/34;C23C16/44;C23C16/452;C23C16/455;C23C16/56;H01L21/00;H01L21/30;H01L21/314;H01L21/318;H01L21/336 主分类号 H01L21/31
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