发明名称 HEAT EXCHANGER FOR COOLING SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING THE SAME
摘要 Behavior of a vapor bubble that emerges should be controlled to improve operational stability and reliability of a phase shift heat exchanger having a microchannel. The heat exchanger has a dual layer structure and includes a material that is elastically deformed according to pressure difference between the layers. The layers are connected, and at the connection interface a resistance unit that exerts a predetermined resistance against a coolant flowing from the coolant supplying layer toward the microchannel layer is provided, to maintain internal pressure of the coolant supplying layer higher than that of the microchannel, under a normal operation. Once a vapor bubble emerges, the relationship in strength of the internal pressure is turned over, and the elastic material is lifted so that the vapor bubble is dividedly distributed over a plurality of microchannels. Alternatively, the internal pressure of the coolant supplying layer may be maintained lower than that of the microchannel, so that once a vapor bubble emerges the vapor bubble is drawn to the lower pressure side.
申请公布号 US2010025019(A1) 申请公布日期 2010.02.04
申请号 US20070518357 申请日期 2007.12.03
申请人 SAKAMOTO HITOSHI;MIKUBO KAZUYUKI;KITAJO SAKAE 发明人 SAKAMOTO HITOSHI;MIKUBO KAZUYUKI;KITAJO SAKAE
分类号 H01L23/34;B21D53/02;F28D15/00;F28F13/00 主分类号 H01L23/34
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