发明名称 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a novel positive resist composition that includes a low molecular material as a base material component, and to provide a method of forming a resist pattern using the positive resist composition. <P>SOLUTION: The positive resist composition includes: a base material component (A) that exhibits increased solubility in an alkali developing solution under the action of acid; and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) comprises a compound (A1) in which either a portion of, or all of, the hydrogen atoms of hydroxyl groups (-OH) within a phenolic compound (I) described below have been substituted with a group containing an acid dissociable, dissolution inhibiting group: the phenolic compound (I) including 4 triphenylmethane structures, and a tetravalent linking moiety that links the 4 triphenylmethane structures, wherein at least one of the 4 triphenylmethane structures has at least one phenolic hydroxyl group. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010026478(A) 申请公布日期 2010.02.04
申请号 JP20080247802 申请日期 2008.09.26
申请人 TOKYO OHKA KOGYO CO LTD 发明人 MIMURA TAKEYOSHI;IRIE MAKIKO
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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