METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board, which is capable of easily processing a hole for forming a via and of obtaining a high degree of freedom of design.

SOLUTION: The method of manufacturing a printed circuit board having a via for connecting one layer to another layer includes steps of: forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole.

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