ANISOTROPIC DRY ETCHING METHOD AND APPARATUS OF COPPER

摘要

PROBLEM TO BE SOLVED: To provide an anisotropic dry etching method of copper capable of performing anisotropic etching to copper without causing corrosion of the copper by halogens. SOLUTION: The anisotropic dry etching method of copper for anisotropically performing dry etching to a copper film formed on a substrate includes: a process for performing anisotropic oxidation treatment to the copper film; and a process for performing dry etching to a copper oxide formed by oxidation treatment using an organic acid without containing any halogens. COPYRIGHT: (C)2010,JPO&INPIT