发明名称 POLYURETHANE POLYUREA RESIN COMPOSITION, AND CURABLE ELECTROMAGNETIC WAVE-SHIELDING ADHERENT FILM USING IT, AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyurethane polyurea resin composition for such an electromagnetic wave-shielding adherent film for use in a flexible printed wiring board as has, after adhering to a flexible printed wiring board, the sufficient electromagnetic wave-shielding property and additionally the heat resistance durable for the high temperature at the time of reflowing a lead-free solder and the more excellent flexing resistance than ever as well as has no reduction in the electroconductivity even when exposed to a high temperature and a high humidity [concretely, after via a pressure cooker test (hereinafter PCT)] and also the excellent wear resistance, and further to provide a curable, electromagnetic-wave shielding adherent film using the same, and a manufacturing method therefor. <P>SOLUTION: The film includes (I) a curable, electroconductive polyurethane polyurea adhesive layer containing (A) a polyurethane polyurea resin and (B) an epoxy resin and a specified amount of an electroconductive filler and (II) a film-like curable insulating polyurethane polyurea resin composition containing (C) a polyurethane polyurea resin, (D) an epoxy resin and (E) a wax. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010024273(A) 申请公布日期 2010.02.04
申请号 JP20080184359 申请日期 2008.07.16
申请人 TOYO INK MFG CO LTD 发明人 MATSUZAWA TAKAHIRO;KOBAYASHI HIDENORI;KUWABARA AKIFUMI;NISHIYAMA YUJI
分类号 C08G18/34;B32B27/40;B32B27/42;C08G18/65;C08G59/58;C08L63/00;C08L75/00;C08L91/00;G09F9/00;H05K9/00 主分类号 C08G18/34
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