| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method capable of attaching an adhesive film for die bonding to the rear surface of each of individual devices divided by a dicing-before-grinding method without deteriorating the quality of the devices. <P>SOLUTION: In the method of manufacturing the semiconductor device in which a wafer with devices formed in a plurality of regions sectioned by a plurality of streets formed in a lattice-like pattern on the front surface is divided along the streets into individual devices, and the adhesive film for die bonding is attached to the rear surface of each of the devices, a rigid plate is pasted on the front surface of the wafer when cut grooves formed along the streets by the dicing-before-grinding method are exposed to divide the wafer into the individual devices, and the adhesive film is attached to the rear surface of the wafer, and thereafter, a separation groove forming step is executed in which the adhesive film is irradiated with a laser beam along the cut grooves from the dicing tape pasted with the wafer having the adhesive tape attached thereon so as to form separation grooves on the adhesive film along the cut grooves. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
