发明名称 STRUCTURE, CONNECTION TERMINAL, PACKAGE, AND ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a structure that facilitates establishing impedance matching, thereby efficiently transmitting a high frequency signal. <P>SOLUTION: The structure 8 includes a substrate 1 made of a dielectric material, and a coplanar line path which is provided on an upper surface of the substrate 1 and has a center conductor 2 and a first ground conductor 3, and a second ground conductor 4 which is electrically connected to the first ground conductor 3 and is provided at a lower position than the upper surface of the substrate 1. The second ground conductor 4 is provided at a position other than a position immediately below the center conductor 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010028800(A) 申请公布日期 2010.02.04
申请号 JP20090125209 申请日期 2009.05.25
申请人 KYOCERA CORP 发明人 KITAMURA TOSHIHIKO
分类号 H01P5/08;H01L23/12;H05K1/02 主分类号 H01P5/08
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