发明名称 HEAT PIPE, ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat pipe which can be mounted inside of an electronic apparatus having only a narrow space, and draws heat from a heating element to diffuse, then transfers the diffused heat to a housing of the electronic apparatus efficiently, and radiates the heat from the surface of the housing. SOLUTION: The heat pipe 1 includes a planar body part 2 which a coolant is enclosed into, and an extension plate 20 protruding from a part or all of a side surface of the body part 2. The body part 2 has a planar upper plate 10, a planar lower plate 11 facing the upper plate 10, and a single or a plurality of middle plates 12 which are laminated between the upper plate 10 and the lower plate 11 to form a vapor diffusion channel and a capillary flow path. The extension plate 20 is formed by making at least one of the upper plate 10, the lower plate 11 and the middle plates 12 larger than the other in area, and the extension plate 20 has a first heat radiation surface 22 and a second heat radiation surface 23 formed by bending at a refracting part 21. At least a part of the first heat radiation surface 22 and the second heat radiation surface 23 can be thermally brought into contact with the housing of the electronic apparatus. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010028055(A) 申请公布日期 2010.02.04
申请号 JP20080191281 申请日期 2008.07.24
申请人 FUCHIGAMI MICRO:KK 发明人 MIZUTA KEI;TSURUTA KATSUYA;KOTANI TOSHIAKI;UEDA SUSUMU
分类号 H05K7/20;F28D15/02;H01L23/427 主分类号 H05K7/20
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