| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of being miniaturized by obtaining a desired polishing rate without being influenced by a contact position on a polishing pad. <P>SOLUTION: The polishing apparatus includes a polishing pad 14 (base member 11) rotatable around a rotational axis O1 orthogonal to a main polishing surface facing a substrate and a sub polishing pad 62 which has a sub polishing surface smaller than the main polishing surface, is mounted on the base member 11 so that the sub polishing surface is substantially flush with the main polishing surface, rotates around the rotational axis O1 along with the polishing pad 14 and which is rotatable around a rotational axis O2 to the polishing pad 14. A surface to be polished of a substrate held by a chuck is brought into contact with the polishing surface (main polishing surface) of the polishing pad 14 rotating around the rotational axis O1 and the polishing surface (sub polishing surface) of the sub polishing pad 62 rotating around the rotational axis O1 along with the polishing pad 14 and rotating around the rotational axis O2 to the polishing pad 14, thereby to polish the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT |
