OLEFIN POLYMER COMPOSITION, FILM AND LAMINATE PRODUCED USING THE COMPOSITION AND MOLD RELEASE FILM FORMED FROM THE FILM OR LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide an olefin polymer composition that can produce a mold release film capable of improving adhesion between a terminal portion of an electric circuit of a printed wiring board and ACF. SOLUTION: The olefin polymer composition comprises (A) an olefin polymer and (B) a sulfur type heat stabilizer wherein the content of the sulfur type heat stabilizer (B) based on 100 pts.wt. of the olefin polymer (A) is 0.5 pts.wt. or more. COPYRIGHT: (C)2010,JPO&INPIT