| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To appropriately split a substrate without damaging a target protective region regardless of the thickness of the substrate. <P>SOLUTION: In the subject manufacturing process, in the first step, the position of a CF substrate base material 10 corresponding to each electrode terminal 16 (target protective region) of a TFT substrate base material 11 is irradiated with a laser beam L to form respective reform region 13. In the second step, the base materials 10, 11 are stuck together and, in the third step, the surface of the stuck base material 12 is exposed to an etching liquid 5 inside a processing liquid tank 4 and is made thinner as a stuck substrate, with a groove 18 formed in the respective reform region 13. Further, by imparting an external force (pressurization, bending stress, etc.), the base material 10 is divided along the groove 18, with the respective reform regions 13, 14 further formed in the manner making a matrix shape with the respective reform region 13 in the inner region of the stuck substrate. Thereafter, through forming of strips with the external force and dicing into chips, a liquid crystal display panel is prepared. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
