| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress peeling of a substrate and an organic resin member by increasing adhesion force between the substrate and the organic resin member, in an inkjet head configured in such a manner that the substrate having a heat generating portion generating heat energy utilized for ejecting ink according to energization and a gold wiring portion for energizing the heat generating portion and the organic resin member in which a discharge port is formed correspondingly to the heat generating portion are arranged in contact with each other. <P>SOLUTION: In an area in contact with the organic resin member (nozzle forming member) on the gold wiring portion, an organic material whose adhesiveness with the organic resin member is higher than that of gold, for instance, a metal layer having a larger number of OH groups on surface than that of the gold is arranged. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
