| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic sensor for positioning an ultrasonic element, and reducing a stress applied to a circuit pattern and a solder bonding section on a printed wiring board and the ultrasonic element. Ž<P>SOLUTION: The ultrasonic sensor includes: the ultrasonic element 1 comprising an ultrasonic oscillator, a cylindrical body 10 for receiving the ultrasonic oscillator and having an opening 10a for passing ultrasonic waves on one surface, and a terminal 11 protruded from the body 10 and supplying power to the ultrasonic oscillator; a rectangular housing 4 comprising a bottomed cylindrical accommodation section 20 having an opening 20a communicated with the opening 10a of the ultrasonic element 1 at the bottom and accommodating the ultrasonic element 1; the flat printed wiring board 5 disposed so as to put the ultrasonic element 1 between the accommodation section 20, and mounting the terminal 11 of the ultrasonic element 1; and a cylindrical elastic member 6 for filling a gap between the accommodation section 20 and the ultrasonic element 1. A flange 60 is provided in the elastic member 6, and covers a portion of one surface of the ultrasonic element 1 opposite to the printed wiring board 5. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
