SOLDER PRINTING DEVICE AND SOLDER PRINTING METHOD

摘要

<P>PROBLEM TO BE SOLVED: To provide a solder printing device and a solder printing method for preventing a printing defect by detecting the adhesion of solder onto a squeegee without omission. Ž<P>SOLUTION: The solder printing device is provided with: an air cylinder 31 for elevating/lowering the squeegee 14 with respect to a screen mask 3; a means for supplying an elevating pressure for an elevating the squeegee 14 and a lowing pressure for lowering the squeegee to the air cylinder 31; a means for measuring the elevation height of the squeegee 14 when a prescribed elevating pressure is supplied to the air cylinder 31 after solder printing; and a means for determining a good or poor solder adhesion on the squeegee 14 based on the elevation height of the squeegee 14. Since the elevation height of the squeegee 14 differs in response to an amount of solder adhesion under the fixed elevation pressure, the good or poor solder adhesion is determined based on the actual elevation height of the squeegee 14. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž