| 摘要 |
A substrate structure for light emitting diodes (LED) chips operation includes a heat spreader, chip holders arranged in the center of the heat spreader, transfer pads located near the chip holders for wire bonding interconnection between the LED chips, and a circuit layer having a gap dividing the circuit layer diagonally. The circuit layer includes a first insulation layer on top of the heat spreader, a metal trace layer on top of the first insulation layer, and a second insulation layer on top of the metal trace layer, wherein portions of the second insulation layer are removed at the opposite corners along the gap, and around the opening, and a conductive plating is plated on the second insulation layer around the opening. Furthermore, a spotlight cap is provided to focus the light emitted from the LED. A LED package includes the substrate structure and the spotlight cap is also provided.
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