| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in film forming property, thermal fluidity and reliability for a semiconductor device such as peeling strength, and to provide a film type adhesive, an adhesive sheet and a semiconductor device using the composition. <P>SOLUTION: The adhesive composition contains polyvinylacetal resin and a thermosetting resin, wherein, when flow amounts of the adhesive composition at 180 in the B-stage and at 180°C in the C-stage are represented by (A) and (B), respectively, (A)-(B) is not less than 100μm, the flow amount at 180°C in the B-stage is not less than 500μm, and the flow amount at 180 in the C-stage is less than 500μm. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
