| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve insulating characteristics of an interface between a center conductor and an insulating layer formed by molding. <P>SOLUTION: The molding insulator includes: a center conductor 1 connected to a main circuit conductor 3, 4 of an electric device; an insulating layer 2 formed in the surrounding of the center conductor 1 by molding; and a pack layer 8 formed by pressurizing and filling up a fluid insulator like a silicon grease in a clearance formed in the interface between the center conductor 1 and the insulating layer 2 due to an imbalance of adhesive strength. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
