| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board, improving the bonding strength of a connection part and an ACF (Anisotropic Conductive Film) or the like, in the mounting process of the printed wiring board. SOLUTION: The manufacturing method of the printed wiring board has a heat press molding process of interposing a mold release film between a base material and a heat press plate and performing heat press to the base material including a substrate where a circuit pattern is formed. In the heat press molding process, a film whose at least one surface layer contains an olefin-based polymer composition containing an olefin-based polymer (A), and a sulfur-based heatproof stabilizer (B), for which the content of the sulfur-based heatproof stabilizer (B) to 100 pts.wt. of the olefin-based polymer (A) is≥0.5 pts.wt., is used as the mold release film. The mold release film is interposed between the heat press plate and the base material so as to abut the layer comprising the olefin-based polymer composition on the connection part provided in the base material, where a part of the circuit pattern is exposed to the surface of the base material. COPYRIGHT: (C)2010,JPO&INPIT |
