WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To form a conductive area inside prepreg without opening a through-hole in a fiber body.

SOLUTION: A wiring substrate and a method of manufacturing the same are provided. There are an organic resin layer which is impregnated up to the inside of a sheet-shaped fiber body and a penetration wiring in which the organic resin layer is dissolved and impregnated in the sheet-shaped fiber body on both sides of a sheet-shaped fiber body. The penetration wiring is exposed to both faces of the organic resin layer while interposing the sheet-shaped fiber body. A semiconductor device and method of manufacturing the same are provided. The semiconductor device has an integrated circuit chip on whose surface of the insulation layer, a bump is exposed. The integrated circuit chip is in close contact with the resin impregnated fiber body compound substrate so that the bump comes in contact with the penetration wiring.

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