| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flat circuit board which is inexpensive, the product design of which can be easily changed and which has excellent heat conductivity. Ž<P>SOLUTION: The method for manufacturing a metal-resin integrated flat circuit board includes: a process for manufacturing a lead frame 1 by forming removed portions r obtained by removing a part or all of a metal plate in a thickness direction on the metal plate with a predetermined pattern; and an insert molding process for clamping the lead frame 1 between a surface side metal mold 2 and a rear side metal mold 3 having flat insert contact surfaces 2c, 3c, respectively and in a state that the whole surface and the whole rear face of the lead frame 1 are brought into close contact with the insert contact surfaces 2c, 3c of the surface side metal mold and the rear side metal mold, directly filling the removed portions r with thermosetting resin 5 containing filler, and forming a circuit board 10 having the same thickness as the lead frame 1 and having flat surface and rear face. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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