| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate on which an electronic component is precisely mounted. Ž<P>SOLUTION: The electronic component mounting substrate includes a native substrate 2 in which a wiring pattern 21 formed of a metal thin film is provided on an insulating substrate 22. A first pattern 21a of the wiring pattern 21 has a first cut 21ax, a second cut 21ay, and a third cut 21az formed therein. The first cut 21ax and third cut 21az are provided at positions where a virtual line connecting corner portions 21aw close to a light emitting element 12 to each other passes a center position G of a place in which the light emitting element 12 is mounted and where distances from the corner portions 21aw and 21aw to the center position G are equal to each other. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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