发明名称 LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD AND ITS MOUNTED SUBSTRATE
摘要 A light emitting device according to the invention includes: a package including a generally quadrangular light emitting surface with a recess formed therein, a rear surface opposed to the light emitting surface, a first side surface generally orthogonal to the light emitting surface and the rear surface, and a second side surface opposed to the first side surface; and a light emitting element provided in the recess. At least one of the first side surface and the rear surface include a first and second feeder electrode surfaces and a mounting surface provided between the first feeder electrode surface and the second feeder electrode surface. A step difference is provided between the first feeder electrode surface and the mounting surface, and a step difference is provided between the second feeder electrode surface and the mounting surface. The first and second feeder electrode surfaces are set back from the mounting surface adjacent thereto. This structure is possible to make a light emitting device high in brightness and thin in thickness.
申请公布号 US2010025722(A1) 申请公布日期 2010.02.04
申请号 US20070514619 申请日期 2007.08.31
申请人 HARISON TOSHIBA LIGHTING CORP. 发明人 WADA NAOKI
分类号 H01L33/00;H01L21/50 主分类号 H01L33/00
代理机构 代理人
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