发明名称 LIGHT-EMITTING DEVICE
摘要 <p>Provided is a light-emitting device capable of preventing peeling at the interface between a lead frame and a package by strengthening the adhesion between the lead frame and the package, preventing a change in the color of the package due to light from a light-emitting element, and efficiently radiating heat generated from the light-emitting element. A light-emitting device, which is provided with a package comprising an opening provided with side surfaces and a bottom surface, and a lead frame exposed on the bottom surface, is characterized in that the lead frame comprises a bent reflection portion on the side surface and part of the inner wall surface of the reflection portion is located inside the package. A light-emitting device, which comprises a package comprising a recessed portion in the front thereof, a lead frame exposed on the bottom surface of the recessed portion, a light-emitting element mounted on the lead frame, and sealing resin filled in the recessed portion, is characterized in that the lead frame comprises a bent portion bent toward the front side of the package in the recessed portion, and a projecting portion bent after projecting outward from the package and disposed on the surface on the reverse side of the front of the package. The light-emitting devices enable the adhesion between the reflection portion formed by bending part of the lead frame and the package to be strengthened, and thus the light-emitting devices capable of preventing peeling at the interface between the reflection portion and the package, preventing a change in the color of the package due to light from the light-emitting element, and efficiently radiating heat generated from the light-emitting element and a phosphor can be provided.</p>
申请公布号 WO2010013396(A1) 申请公布日期 2010.02.04
申请号 WO2009JP03192 申请日期 2009.07.08
申请人 NICHIA CORPORATION;KANADA, MORITO;ASAKAWA, HIDEO 发明人 KANADA, MORITO;ASAKAWA, HIDEO
分类号 H01L33/00 主分类号 H01L33/00
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