SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which does not cause trouble such as breaking of wiring by improving bending property of a heat dissipating material although the heat dissipating material is provided. SOLUTION: A COF 10 is provided with the heat dissipating material 7 such that the volume (area) is made small by providing openings of larger area in regions at peripheries of ends 7a and 7b of the heat dissipating material. This configuration improves the bending property when the COF 10 is bent and thus stress caused by the bending is prevented from concentrating on the ends 7a and 7b of the heat dissipating material 7 to avoid breaking of the wiring 2 on an insulating film 1. Further, when the COF 10 is mounted on a display device 30, peeling of an anisotropic conductive resin used to bond the COF 10 and display panel 15 together can be eliminated. COPYRIGHT: (C)2010,JPO&INPIT