| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress particles generated in an in-line sputtering apparatus. Ž<P>SOLUTION: The sputtering apparatus 10 for executing the film deposition while moving a substrate 11 includes a film deposition chamber 14 capable of performing the atmospheric control, a sputter source 18 for depositing a film of a predetermined material by the sputtering method on the substrate 11 arranged in the film deposition chamber 14, a supporter (a substrate holder 12 and a supporter shaft 15) for supporting and conveying the substrate 11, and a magnetic motion transmitting mechanism for transmitting the motion from the outside of the film deposition chamber 14 to the supporter in the film deposition chamber 14 via the magnetic force. The supporter can be moved from the outside of the film deposition chamber, generation of particles associated with the movement of the supporter is suppressed, and pollution of the substrate is prevented. Further, when the supporter shaft is subjected to the straight motion via the magnetic force, the substrate can be moved by the supporter without using any rotating body such as a roller and a gear, and the amount of particles during the conveyance is reduced. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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