| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flowability, adhesion, dimensional stability, and low stress characteristics, and to provide an electronic component device using the same. Ž<P>SOLUTION: The epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) a silicone compound, wherein (C) the silicone compound contains both (c1) a silicone compound having a Si-OH at its both terminals, and (c2) a silicone compound represented by general formula (I-2) (in the formula (I-2), l is an integer of 0 or 1 or more, m is an integer of 1 or more, n is an integer of 1 or more, R<SP>2</SP>s are selected from 1-18C monovalent hydrocarbon groups and each R<SP>2</SP>may be identical or different, R<SP>3</SP>s are selected from monovalent organic groups having an epoxy group and each R<SP>3</SP>may be identical or different, and R<SP>4</SP>s are selected from monovalent organic groups having a polyalkylene ether group and each R<SP>4</SP>may be identical or different). An electronic component device using the same is also provided. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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