| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin adhesion preventing composition for electronic components, which contains a polymer having a polymerization unit derived from an unsaturated compound containing a polyfluoroalkyl group or the like having a number of carbon atoms of not higher than 6 and little influence on the living body and the environment, and which has a performance equivalent to a conventional composition containing a polymer having a polymerization unit derived from an unsaturated compound in which the number of carbon atoms of a polyfluoroalkyl group is not lower than 8. SOLUTION: The resin adhesion preventing composition for electronic components contains a polymer having a polymerization unit (A) derived from a compound represented by following formula (a): CH<SB>2</SB>=C(R<SP>1</SP>)-COO-(CH<SB>2</SB>)<SB>n</SB>-R<SP>f</SP>, wherein, R<SP>1</SP>is a halogen atom or a trifluoromethyl group; R<SP>f</SP>is a polyfluoroalkyl group or a polyfluoroether group having a main chain with a number of carbon atoms of not higher than 6; and n is an integer of 0-6. COPYRIGHT: (C)2010,JPO&INPIT
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