| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board in which when a coating film is formed using a masking tape, the masking tape is peeled while suppressing damage to the coating film and a fine coating film is formed and to provide a masking tape used in implementing the method for manufacturing the printed wiring board. SOLUTION: A given area on a board 11 having a wiring pattern is masked with a masking tape 12 having a stepped portion 12c on its lateral end, and a coating film 13 is formed on the board 11. The coating film 13 is then cut on the stepped portion 12c of the masking tape 12, and the masking tape 12 is peeled off to form the coating film 13 in an area excluding the given area on the board 11. COPYRIGHT: (C)2010,JPO&INPIT
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