| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles for preventing migration, maintaining high conductivity, and preventing short circuit caused by particle agglomeration. SOLUTION: The conductive particles include resin particles, and a metal coating layer for coating the resin particles. The metal coating layer includes an electroless-plated inner copper plated layer, and a displacement plating outer tin plated layer. A thickness of the copper plated layer is 0.040-0.120 μm. A thickness of the tin plated layer is 0.030-0.110 μm. A thickness of the entire metal coated layer is 0.070-0.150 μm. COPYRIGHT: (C)2010,JPO&INPIT |
