| 摘要 |
A method for fabricating a printed circuit board having semiconductor components embedded therein is provided. A carrier board having at least a predetermined hole area is provided. A plurality of through holes are formed in the surround of the predetermined hole area on the carrier board. A rectangular cavity is formed by punching to remove the predetermined hole area, and a plurality of through holes are formed around the rectangular cavity The through holes facilitate receipt of the semiconductor chip and filling of a fixing material in the rectangular cavity, to avoid displacement of the semiconductor chip in subsequent fabricating steps that would otherwise cause a drawback, that is, a wiring to be formed later is improperly electrically connected to the semiconductor chip.
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