OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

摘要

Disclosed is an optical semiconductor sealing resin composition containing a rubber particle-dispersed epoxy resin (A) which is obtained by dispersing rubber particles in an alicyclic epoxy resin.  Each rubber particle is composed of a polymer which contains a (meth)acrylate ester as an essential monomer component, and has a hydroxyl group and/or a carboxyl group on the surface as a functional group which is reactive with alicyclic epoxy resins.  The rubber particles have an average particle diameter of 10-500 nm and a maximum particle diameter of 50-1000 nm, and the difference between the refractive index of the rubber particles and the refractive index of a cured product of the optical semiconductor sealing resin composition is within ±0.02.  A cured product exhibiting excellent crack resistance while maintaining high heat resistance and transparency can be obtained from the optical semiconductor sealing resin composition.