| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic instrument and its production process that can stably and equally fill up reinforcement resin material and can get an increase and reliability of reinforcement strength after having done surface mounting of a BGA-type semiconductor device in which solder ball bumps are densely and sparsely arranged. <P>SOLUTION: The electronic instrument has a semiconductor device H having a part A provided with two or more solder ball bumps a and a part N not provided with the solder ball bumps, a printed circuit board P having two or more electrode pads b solder-bonded through surface-mounting to the solder ball bumps prepared on the semiconductor device, a resin material G underfilled in a clearance between the semiconductor device and the printed circuit board and filled up around the solder ball bumps of the semiconductor device and the electrode pads of the printed circuit board to be flip-chip bonded, and two or more dummy electrode pads 1 prepared so as to face to the part in which the printed circuit board is not provided with the solder ball bumps of the semiconductor device. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
