MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD, AND MANUFACTURING APPARATUS FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed circuit board, and to provide a manufacturing apparatus for the same.

SOLUTION: A substrate 100 includes an insulating layer 110 on which contact holes are formed; a conductive layer 150 disposed on the insulating layer 110 including the contact holes; and a photosensitive layer 160 disposed on the conductive layer 150. First position data corresponding to the positions of the contact holes are generated, position correction data corresponding to errors between the first position data and the second position data corresponding to pad positions in design are generated, a photosensitive pattern is formed by applying exposure and development steps to the photosensitive layer 160 on the basis of the position correction data, and pads are formed according to the photosensitive pattern.

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