发明名称 THIN-FILM DEVICE, METHOD FOR MANUFACTURING THIN-FILM DEVICE, AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide technique for manufacturing a flexible thin-film device. Ž<P>SOLUTION: A method for manufacturing the thin-film device includes: forming a separation layer (11) on a substrate (10); forming a support layer (12) containing silicate mineral containing clay as a principal component and having a layered crystal structure on the separation layer; forming a thin-film body (14) on the support layer; applying an energy to the separation layer to reduce the adhesion between the separation layer and each of the substrate and support layer; and removing the substrate from the support layer and the thin-film body. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010027767(A) 申请公布日期 2010.02.04
申请号 JP20080185815 申请日期 2008.07.17
申请人 SEIKO EPSON CORP 发明人 ONODERA KATSUMI
分类号 H01L21/02;H01L21/336;H01L27/12;H01L29/786 主分类号 H01L21/02
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