发明名称 |
THIN-FILM DEVICE, METHOD FOR MANUFACTURING THIN-FILM DEVICE, AND ELECTRONIC EQUIPMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide technique for manufacturing a flexible thin-film device. Ž<P>SOLUTION: A method for manufacturing the thin-film device includes: forming a separation layer (11) on a substrate (10); forming a support layer (12) containing silicate mineral containing clay as a principal component and having a layered crystal structure on the separation layer; forming a thin-film body (14) on the support layer; applying an energy to the separation layer to reduce the adhesion between the separation layer and each of the substrate and support layer; and removing the substrate from the support layer and the thin-film body. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010027767(A) |
申请公布日期 |
2010.02.04 |
申请号 |
JP20080185815 |
申请日期 |
2008.07.17 |
申请人 |
SEIKO EPSON CORP |
发明人 |
ONODERA KATSUMI |
分类号 |
H01L21/02;H01L21/336;H01L27/12;H01L29/786 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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