发明名称 Integrated Circuit and Method of Forming Sealed Trench Junction Termination
摘要 An integrated circuit having a substrate with a first conductivity type of semiconductor material. A buried layer is formed in the substrate. The buried layer has a second conductivity type of semiconductor material. A first semiconductor layer is formed over the buried layer. The first semiconductor layer has the second conductivity type of semiconductor material. A trench is formed through the first semiconductor layer and buried layer and extends into the substrate. The trench is lined with an insulating layer and filled with an insulating material. A second semiconductor layer is formed in the first semiconductor layer. The second semiconductor layer has the first conductivity type of semiconductor material. A third semiconductor layer is formed in the second semiconductor layer. The third semiconductor layer has the second conductivity type of semiconductor material. The first, second, and third semiconductor layers form the collector, base, and emitter of a bipolar transistor.
申请公布号 US2010025809(A1) 申请公布日期 2010.02.04
申请号 US20080182699 申请日期 2008.07.30
申请人 TRION TECHNOLOGY, INC. 发明人 BOWMAN RONALD R.
分类号 H01L29/732;H01L21/331 主分类号 H01L29/732
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