| 发明名称 |
FAN-IN INTERPOSER ON LEAD FRAME FOR AN INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM |
| 摘要 |
An integrated circuit package on package system includes: providing a lead having a wire-bonded die with a bond wire connected thereto; mounting a fan-in interposer over the wire-bonded die and the bond wire; connecting the fan-in interposer to the lead with the bond wires; and encapsulating the wire-bonded die, bond wires, and the fan-in interposer with an encapsulation leaving a portion of the fan-in interposer exposed.
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| 申请公布号 |
US2010025834(A1) |
申请公布日期 |
2010.02.04 |
| 申请号 |
US20080185061 |
申请日期 |
2008.08.01 |
| 申请人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;TAY LIONEL CHIEN HUI;BATHAN HENRY DESCALZO |
发明人 |
CAMACHO ZIGMUND RAMIREZ;PISIGAN JAIRUS LEGASPI;TAY LIONEL CHIEN HUI;BATHAN HENRY DESCALZO |
| 分类号 |
H01L23/28 |
主分类号 |
H01L23/28 |
| 代理机构 |
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