| 摘要 |
A chip mounting apparatus is provided with a chip holding means, a pressurizing means which applies a pressurizing force to the chip holding means, and a drive control means which movably controls the pressurizing means in the height direction of the apparatus, and the chip mounting apparatus bonds chip bumps to an electrode of a substrate by solder bonding. The chip mounting apparatus is also provided with a predicting/controlling means, which predicts the expanding quantity of the chip holding means in a period between a time when the chip holding means is heated to a time when the bumps of the chip are molten, inputs a correction instruction to the drive control means, based on the predicted value of the expanding quantity of the chip holding means, and controls the height position of the pressurizing means. Thus, the production tact time is shortened, and chips such as an integrated circuit element can be mounted with high reliability on substrates such as a printed board. |
