| 摘要 |
[PROBLEMS] To solve problems of the prior art and to meet demands, that is, a problem involved in the conventional white laminated plate for a printed wiring board that a heat curable resin part undergoes a color change by heat and causes a lowering in reflectance, a problem of LEDs using an ultraviolet luminescent element that a substrate for mounting an LED chip is deteriorated and undergoes a color change upon exposure to ultraviolet light, leading to an increasing demand for substrates having much less susceptibility to a color change upon exposure to ultraviolet light and heat, and a demand for a plate thickness accuracy high enough not to cause liquid leakage and the like in the step of sealing of chip LEDs. [MEANS FOR SOLVING PROBLEMS] A white prepreg characterized by being produced by impregnating a sheet-like glass fiber base material with a resin composition (E) comprising an epoxy resin (A) containing an alicyclic epoxy resin (A1), a glycidyl (meth)acrylate polymer (B), a white pigment (C), and a curing agent (D) as indispensable components, and drying the impregnated sheet-like glass fiber base material. A white laminated plate characterized by being produced by laminating one or a plurality of sheets of white prepreg on top of each other and heat pressing the assembly. |
