| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sealing method and a sealing device that suppress breakage of an electronic element, wiring, etc., and a method of manufacturing an electronic device. <P>SOLUTION: Provided is the sealing method of supplying a body to be sealed and a resin to between a first pattern and a second pattern, and applying compressive force to the resin by putting the first pattern and second pattern relatively closer to each other to seal a sealing range of the body to be sealed with the resin, wherein the supplied resin is larger than the sealing range and the resin put in the sealing state by applying the compressive force is expanded up to an outer peripheral end of the body to be sealed or to outside the body to be sealed beyond the outer peripheral end. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
