发明名称 ADHESIVE FOR CONNECTING ELECTRODES
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an adhesive for connecting electrodes, which is hardened at low temperature and within a short period of time, with which connection reliability between the electrodes is improved, and which is excellent in stability during storage and heat resistance, in connecting between electrodes via the adhesive for connecting electrodes. <P>SOLUTION: The metal electrode 5 of a flexible printed circuit board 3 and the metal electrode 4 of a wiring substrate 1 are connected with each other via the adhesive 2 for connecting the electrodes, the adhesive 2 containing an epoxy resin as a main component, electroconductive particles and a hardening agent, wherein the adhesive 2 for connecting the electrodes contains a phenoxy resin having a molecular weight of 10,000 or more and a glass transition temperature of 80°C or more and a crystalline epoxy resin as the epoxy resin, and contains a pulverized urea-based hardening agent and a microcapsule type hardening agent as the hardening agents. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010024416(A) 申请公布日期 2010.02.04
申请号 JP20080191105 申请日期 2008.07.24
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TOSHIOKA HIDEAKI;OKUDA YASUHIRO
分类号 C09J163/00;C09J9/02;C09J11/04;C09J171/12;H01B1/00;H01B1/22;H01R11/01;H05K1/14;H05K3/32 主分类号 C09J163/00
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