发明名称 |
Resin Composition for LED Encapsulation |
摘要 |
Disclosed is a resin composition for LED encapsulation including an organic oligosiloxane hybrid prepared by non-hydrolytic condensation of organoalkoxysilane. More particularly, the resin composition for LED encapsulation includes an organic oligosiloxane hybrid prepared by non-hydrolytic condensation of organoalkoxysilane with organosilanediol or non-hydrolytic condensation of a mixture containing organoalkoxysilane and metal alkoxide with organosilanediol. The prepared organic oligosilane hybrid has an inorganic network structure with a high degree of condensation and contains at least one organic group or organic functional group. In addition, an encapsulated LED fabricated using the above resin composition for LED encapsulation is provided.
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申请公布号 |
US2010025724(A1) |
申请公布日期 |
2010.02.04 |
申请号 |
US20090463321 |
申请日期 |
2009.05.08 |
申请人 |
BAE BYEONG-SOO;YANG SEUNG-CHEOL |
发明人 |
BAE BYEONG-SOO;YANG SEUNG-CHEOL |
分类号 |
H01L33/00;C08G77/00;C08L83/04 |
主分类号 |
H01L33/00 |
代理机构 |
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地址 |
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